The PRM S-6400 PCB Stress Test Instrument is designed in compliance with IPC/JEDEC-9704 standards to accurately measure micro-strain during PCB manufacturing processes such as FCT and ICT. It enables early detection of device failure risks caused by PCB warpage or deformation. With high-precision strain quantification and real-time fault localization, it is widely used in home appliances, automotive electronics, and high-end consumer electronics to improve fixture design, optimize process flows, and enhance production yield.